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Broadcom Announces Availability of the BCM63158


October 27, 2017

Broadcom Ltd. announced the availability of its integrated broadband CPE SoC (system on chip), the BCM63158. Meshing Gfast, xDSL, and GPON into one integrated device, the BCM63158 enables telecom service providers the ability to deploy copper or fiber broadband services via a singular, unfied platform, per Broadcom.


The company says that, by utilizing bonded 35b, bonded 106-MHz G.fast, and single-line 212-MHz Gfast with Broadcom’s RNC (Reference Noise Cancellation), internet browsing speeds will improve. Being backward compatible to ADSL/VDSL and LR-VDSL helps deploy BCM63158-based products. It enhances performance and security for smart home apps and “modern containerized offerings,” according to the company.

"Combining both G.fast and GPON into a single device enables service providers to future-proof CPE product offerings as telecom operators deploy both copper and fiber-based solutions. Further, the advanced processing capability of the BCM63158 enables secure, modern containerized software architectures along with the benefits of home networks supporting 802.11ax," shared Greg Fischer, senior vice president and general manager, Broadband Carrier Access, Broadcom.

The BCM63158 is built to support the high-speed demands of tri-band 802.11ax home networking along with Broadcom's BCM43684 WLAN chipset, multi-Gigabit Ethernet data rates, VoIP, and network attached storage.

Broadcom combines fiber with various technologies; it is the key to creating a proper balance between performance, time-to-deployment and cost which enables ubiquitous ultra-broadband service. Broadcom is also a designer, developer and global supplier of a broad range of analog and digital semiconductor connectivity solutions. Its portfolio serves four primary markets, including wired infrastructure, wireless communications, enterprise storage and industrial & other.

According to Research and Markets, Broadcom is a leading vendor of switch semiconductor solutions focused on highperformance interconnect




Edited by Maurice Nagle

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